Cleaning - Business - HANSOLIONES

Hansol IONES ultra-precision cleaning technology extends product
life and restores characteristics through various cleaning methods to
remove and recycle pollutants generated after the semiconductor and display manufacturing process.

Remove Contamination Sources

Pre-removal of contaminants from the surface of parts to prevent internal contamination

The dropped pollutant directly affects the semiconductor microcircuit, eliminating the cause of yield degradation.

Remove residual metallic ions from parts after decontamination

Reduce the cost of purchasing parts

Semiconductor parts are expensive products and are cleaned of pollutants periodically to maximize the use cycle of parts.

Restore Product Properties

Restoring the surface treatment suitable for the characteristics of the part to the initial state by the surface treatment process (Bead & Arc spray coating)

Etch Cleaning

OUTER LINER (ANODIZING+Y2O3)

Before cleaning
After cleaning

ISOLATOR (CERAMIC)

Before cleaning
After cleaning

ESC (ANODIZING+CERAMIC)

Before cleaning
After cleaning

Metal Cleaning

ONE-PIECE SHIELD

Before cleaning
After cleaning

DEPO RING

Before cleaning
After cleaning

SHUTTER DISK

Before cleaning
After cleaning

CVD Cleaning

GAS BOX

Before cleaning
After cleaning

UPPER CHAMBER RING

Before cleaning
After cleaning

SHOWER HEAD

Before cleaning
After cleaning

Diffusion Cleaning

ALD SEAL CAP

Before cleaning
After cleaning

FLANGE

Before cleaning
After cleaning

MANIFOLD

Before cleaning
After cleaning

Cleaning Technology

Cleaning type

Distinguish	Wet Cleaning	Dry cleaning (Physical)
Description	IRemove Polymer, Metal, Carbon, Oil, Wax, Residue Resist, Fingerprint with Hansol IONES Optimized Chemical	Remove Polymer, Metal, Carbon, Oil, Wax, Residue Resist, Fingerprint using state-of-the-art equipment
Main Use	Remove APM(SC-1) NH4OH/H2O2/H2O Particles HPM (SC-2) HCl/H2O2/H2O Metal Impurities Removal SPM H2SO4/H2O2 Organic Products Removal DHF HF/H2O Natural Oxide Removal BHF NH4F/HF/H2O Oxide Removal, Etching FPM HF/H2O2 Metal Impurity Removal Ozone hydrofluoric acid HF/O3/H2O Oxide removal	Remove CO2 blaster particles, remove organic residues Better Bedblaster Illuminance Adhesion (Surface Shanghang) Arc Spray Light Formation Adhesion Enhancement (Surface Shanghang) Laser Inorganic Residues Removal Decomposition of organic residues in Furnace Plasma Removal of Organic Residues, Metal Residues, and Natural Oxidation Membranes
Advantages	It is easy to clean with water after the process. After drying, residues can be avoided with DI water and proper drying methods. There is no flammability in the liquid used. Various types of chemical solutions are available. to be cheap It works well for both organic and non-organic removal. The selective removal ability is relatively superior.	Easy to achieve full-scale cluster tool process It is advantageous to the High AR structure. Particle is easier to control in gas than liquid. Chemical solutions and DI water use are low. It is a safer process than the Wet Cleaning process. Waste fluid emissions are low and easy to dispose of.
Expected Effects	Optimization cleaning by material increases part usage time Contribute to stabilizing customer processes (Life Time, Vpp enhancement, Etch enhancement)	Optimization cleaning by material increases part usage time Contribute to stabilizing customer processes (Life Time, Vpp enhancement, Etch enhancement)

New Technology Development

Distinguish	Eco Cleaning Solution	ICRS (Ion Carbon Removal System)	U Cleaning	SMS (Surface Mobility System)
Description	Ultrasonic Replaceable ECO Cleaning (Remove organic matter and particles due to high voltage radiation and microbubble effect)	Depoised oil or processed oil is harmless to the human body and quickly removed	Effectively remove metal contaminants attached to the part through anionic special cleaning solution.	Introduction of a physicochemical cleaning method that removes only process by-products without damaging the coating layer with a dense structure
Expected Effects	To prevent damage to the coating film Removal of organic matter Remove Particle Ensuring safety → Contribute to stabilization of customer process	Used in products with high surface oiliness or out of touch with tools to effectively remove eco-friendly cleaning methods, safety guarantees, and F ions. → Contribute to stabilization of customer process	Reduces customer backup time by removing cleaning surface contamination sources → Contribute to stabilization of customer process	Effect of customer backup time by removing the source of contamination on the surface of coated products → Contributions to the stabilization process.